Numerical simulation of the hydrodynamic semiconductor device equations requires powerful numerical schemes. A Space-time Galerkin/Least-Squares finite element formulation, that has been successfully applied to problems of fluid dynamic, is proposed for the solution of the hydrodynamic device equations. Similarity between the equations of fluid dynamic and semiconductor devices is discussed. The robustness and accuracy of the numerical scheme are demonstrated with the example of a single electron carrier submicron silicon MESFET device.

This paper describes an implementation of the finite element method to examine the effects of actual lip shape on the sound radiation. A three-dimensional finite element approach by Galerkin method was used. The accuracy of the calculation of finite element method for the sound radiation was tested by comparing it with the exact solutions for a circular piston radiator on an infinite baffle. Using a set of finite element models of the vocal tract, we calculated the responses to a pure tone input and the sound fields over the frequency range of 100 Hz-7 kHz. The transfer functions are examined in detail for vowels /a/ and /i/ when the shape of the actual lips is simplified as a planeradiation surface. The effects of lip shape on the distribution of sound pressures are also shown in both the vocal tract and the surrounding space of the mouth opening.

Properties of a strongly-coupled nonlinear directional coupler (NLDC) with a lossy MQW coupling layer is analyzed using the Galerkin finite element method accompanied by a predictor-corrector algorithm. It is shown that the propagation attenuation along the NLDC is considerably smaller than that in the bulk MQW and tends to reduce with the input power. By the presence of losses, the powers guided in two waveguides do not become a maximum and a minimum at the same propagation length, unlike the lossless coupler. The losses make the nonlinear effect weak due to the decrease in guided power, and hence the coupling length decreases and the switching power increases. The extinction ratio of the switching becomes the largest value not in the cases of nonloss and high losses but in the case of moderately high losses, although the switching power is somewhat larger than that of the lossless case.

This paper is concerned with the stress simulation of a LOCOS structure during not only oxidation but also the subsequent cooling down based on viscoelastic stress modeling. A viscoelastic model is successfully applied to the oxide, nitride and silicon substrate for a LOCOS structure. Thermal stress is also taken into account during the cooling down process. The viscoelastic deformation problem of all the three materials for the LOCOS structure are solved by a two-dimensional finite element method. It is the first time to show that the stress values after cooling down to room temperature are much higher than those right after oxidation. It is also shown that varying the cooling down rates results in the different stress values after cooling down.

In this paper, a three part algorithm is employed to obtain stable convergence during stress dependent oxidation simulation using the finite element method is presented. By introducing (1) a reduced integration formulation, (2) an averaging procedure for the mid-side node velocities at the Si/SiO2 interface, and (3) a three-node element to discretize the oxidant diffusion equation, major improvements in achieving stable convergence are realized during stress dependent oxidation simulation. This technique is generally applicable for an oxidation simulator using the finite element method.